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 Program Schedule
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ISSM 2006 Schedule and Areas of Interest
- Factory Design (FD)
- Manufacturing Control and Execution (MC)
- Manufacturing Strategy and Structure (MS)
- Process Control and Monitoring (PC)
- Process and Metrology Equipment (PE)
- Yield Enhancement Methodology (YE)
- Ultraclean Technology (UC)
- Environment, Safety and Health (ES)
- Process and Material Optimization (PO)
- Final Manufacturing (FM)
- Robust Engineering (RE)
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Note: Abstract of each paper will be available from the end of August by click on the presentation title.
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Mon, Sep 25 | Tue, Sep 26 | Wed, Sep 27 | Interactive
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- 8:30 Registration
- 9:40-10:00 Opening Remarks
- Hajime Sasaki, Chairman, ISSM Organizing Committee/NEC
Michihiro Inoue, Chairman, ISSM Executive Committee/Panasonic
- 10:00-11:40 Plenary Session
- Session Chair: Kensuke Uriga/Chairman, ISSM Program Committee/Dura Systems
- 10:00-10:50 Conquering Process Variability: A Key Enabler for Profitable Manufacturing in Advanced Technology Nodes
- Andrzej.J. Strojwas Professor of Electrical and Computer Engineering, Carnegie Mellon Univ. Chief Technologist, PDF Solutions, Inc.
- 10:50-11:40 Collaboration in the 21st Century: Driving Innovation and Differentiation
- Song Hwee Chia, President and Chief Executive Officer Chartered Semiconductor Manufacturing
- 11:40-13:00 Lunch Time
- 13:00-17:20 Session 1 (Room A)
- Yield Enhancement Methodology(YE) & Environment, Safety and Health (ES)
- 13:00-13:20 YE-131
- Watermark induced High Density Via failures in sub micron CMOS fabrication
Alex Chew Keng Chiow/Systems on Silicon Manufacturing
- 13:20-13:40 YE-198
- In Situ Particle Monitors: The Next Level of Yield Control for Critical Processes
Ray Burghard/INFICON
- 13:40-14:00 YE-153
- Voltage Comtrast Enhance for Gate Leak Failure Detected by Electron Beam Inspection
Katsuhiro Fujiyoshi/Renesas Technology
- 14:00-14:20 YE-126
- Method of Minimizing Inspection Cost by Making Use of Programmed Defect Array
Takahide Hayano/Spansion
- 14:20-14:40
- Authors' Interview Hours/Coffee Break
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- 14:40-15:00 YE-197
- Failure Mode Detection and Process Optimization for 65 nm CMOS Technology
Jeffrey R. D. DeBord/Texas Instruments
- 15:00-15:20 YE-200
- Electrical Defect Density Test Structures for DFM in the Sub-wavelength Lithography Regime with Copper Metallization
Julie Segal/Spansion
- 15:20-15:40 YE-211
- An Addressable Test Structure for Geometrical Design Rules Characterization
Hung-Jen Lin/Spansion
- 15:40-16:00 YE-217
- Sample Effcient Regression Trees (SERT) for Yield Loss Analysis
Argon Chen/National Taiwan University
- 16:00-16:20
- Authors' Interview Hours/Coffee Break
- 16:20-16:40 ES-69
- Analysis and Risk Communication of 20 Years of Exposure Monitoring of Photolithography Solvents from all Intel Fabs
Harry A. Hunsaker/Intel
- 16:40-17:00 ES-122
- Application of Atmospheric Plasma Abatement System for exhausted gas from MEMS etching process
Kenji Hattori/Taiyo Nippon Sanso Corporation
- 17:00-17:20
- Authors' Interview Hours/Coffee Break
- 13:00-17:20 Session 2 (Room B)
- Manufacturing Control and Execution (MC)
- 13:00-13:20 MC-221
- Development of a Platform for Collaborative Engineering Data Flow between Design and Manufacturing
Hiroyuki Morinaga/Toshiba
- 13:20-13:40 MC-92
- Risk Based Capacity Planning Method for Semiconductor Fab with Queue Time Constraints
Akira Ono/Renesas Technology
- 13:40-14:00 MC-231
- Priority X-Factor Modeling for Differentiated Manufacturing Service Planning
Shi-Chung Chang/National Taiwan University
- 14:00-14:20 MC-80
- 300mm Time Constrained Queue Loop Management
David L. Van Sickle/Intel
- 14:20-14:40
- Authors' Interview Hours/Coffee Break
- 14:40-15:00 MC-94
- A Dynamic Method for Optimal WIP Allocation and Control in a Semiconductor Manufacturing System
Chih Ming Liu/National Tsing Hua University
- 15:00-15:20 MC-93
- Supply Chain Inventory Control in Semiconductor Manufacturing
Ruey-Shan Guo/National Taiwan University
- 15:20-15:40 MC-60
- Cycle Time Reduction Through Preventive Maintenance De-clustering
Mike Tao Zhang/Intel
- 15:40-16:00 MC-117
- Conveyer Belt Model to Analyze Cycle Time Conditions in a Semiconductor Manufacturing Line
Toshikazu Inoue/Spansion
- 16:00-16:20
- Authors' Interview Hours/Coffee Break
- 16:20-16:40 MC-179
- Troubleshooting Tracks with Vibration Detection and Storage Technology.
Wahner, Lester J/Intel
- 16:40-17:00 MC-113
- Increased Etch Chamber Productivity Through the Reduction of Unshceduled Wet Cleans
Brent Ames/Metron Technology
- 17:00-17:20 MC-48
- Wire Bonder Mis-Process Reduction and Productivity Improvement Through Full Automation System: A Cross Regional Team Project
TAY CHAI THEAM/Texas Instruments
- 17:20-17:40
- Authors' Interview Hours/Coffee Break
- 13:00-18:00 Session 3 (Room C)
- Process Control and Monitoring (PC) Part 1
- 13:00-13:20 PC-176
- The Future of CD Metrology
John Allgair/International Sematech
- 13:20-13:40 PC-90
- Gate CD Control Considering Variation of Gate and STI Structure
Masaru Kurihara/Hitachi
- 13:40-14:00 PC-64
- New Mechanism of LER Formation in Gate Process
Atsushi Yabata/Miyagi Oki Electric Co.,Ltd
- 14:00-14:20 PC-142
- Development on the Highly Precise Detection System for the Abnormal Discharge at the Plasma Etching Equipment
Hirotoshi Ise/Renesas Technology
- 14:20-14:40
- Authors' Interview Hours/Coffee Break
- 14:40-15:00 PC-215
- Development of monitoring technology of ion implanter for particle detection
Satoshi Yasuda/Matsushita Electric (Panasonic)
- 15:00-15:20 PC-209
- Device-level APC in Ion Implantation for Analog Device
takashi kyuho/Toshiba
- 15:20-15:40 PC-214
- Fab-wide equipment monitoring and FDC system
Shin-ichi Imai/Matsushita Electric (Panasonic)
- 15:40-16:00 PC-49
- Using a Z Tool Controller for APC Applications
Eugene Smith/Cypress Semiconductor
- 16:00-16:20
- Authors' Interview Hours/Coffee Break
- 16:20-16:40 PC-83
- Improvement of photolithography process by 2nd Generation Data Mining
Hidetaka Tsuda/Fujitsu LSI Technology Limited
- 16:40-17:00 PC-186
- Enabling Double Patterning Lithography at the 32nm Node
Kevin Monahan/KLA-Tencor
- 17:00-17:20 PC-144
- High sensitive focus monitoring on production wafer by Scatterometry Measurements for 90/65nm node devices.
Toshihide Kawachi/Renesas Technology
- 17:20-17:40 PC-247
- Laser Scattering Microhaze Correlation with Polysilicon Surface Roughness and Impact on Electrical Performance
David K. Chen/KLA-Tencor
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Mon, Sep 25 | Tue, Sep 26 | Wed, Sep 27 | Interactive
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- 8:00 Regiration
- 9:00-10:40 Plenary Session Session
- Chair: Kensuke Uriga/Chairman, ISSM Program Committee/Dura Systems
- 9:00-9:50 The CASMAT Business Model for Semiconductor Materials
- Yoshifumi Kawamoto, Director, General Manager, R&D Department Consortium for Advanced Semiconductor Materials and Related Technologies (CASMAT)
- 9:50-10:40 Toshiba's Strategy in Semiconductor Business and Production Technology
- Shozo Saito, Executive Vice President, Toshiba Semiconductor Company, Corporate Vice President, Toshiba Corporation
- 10:40-11:00
- Coffee Break
- 11:00-14:40 Session 4 (Room A)
- Process and Materials Optimization (PO)
- 11:00-11:20 PO-125
- Advanced CD Control Technology for 65-nm Node Dual Damascene Process
Masatoshi Nagase/NEC Electronics
- 11:20-11:40 PO-148
- Novel Deep SAC Etch Process Technology for advanced FCRAMTM*
Daisy Yang/SMIC
- 11:40-12:00 PO-246
- Low Erosion Tungsten CMP Process with High Productivity
Masafumi Shiratani/NEC Electronics
- 12:00-12:20 PO-54
- Elimination of Vmin failures in 0.15um logic process
Yee Ming Chan/Systems on Silicon Manufacturing
- 12:20-12:40
- Authors' Interview Hours/Coffee Break
- 12:40-13:40
- Lunch Time
- 13:40-14:00 PO-61
- Impact on Latchup Immunity due to the Switch From Epitaxial to Bulk Substrate
Glen Foo Eu Gene/Systems on Silicon Manufacturing
- 14:00-14:20 PO-100
- Analog Capacitor Integration Challenges
Xinfen Chen/Texas Instruments
- 14:20-14:40
- Authors' Interview Hours/Coffee Break
- 11:00-14:40 Session 6 (Room B)
- Ultraclean Technology (UC)
- 11:00-11:20 UC-116
- Environmentally Friendly Single-Wafer Spin Cleaning Using Ultra-diluted HF/nitrogen Jet Spray without Causing Structural Damage and Material Loss
Hideki Hirano/Sony
- 11:20-11:40 UC-124
- A Defect-Free Anodic Oxide Passivation for LSI/FPD Vacuum Chamber
Yasuhiro Kawase/Mitsubishi Chemical
- 11:40-12:00 UC-164
- Wonderful new materials or yield killers? New metrics for metal contamination assessment
GABRIELA CATANA/IMEC
- 12:00-12:20 UC-123
- Impact on Off-state Leakage Current in PMOS Device by Metallic Contamination
Young Seon You/Systems on Silicon Manufacturing
- 12:20-12:40 Authors' Interview Hours/Coffee Break
- 12:40-13:40
- Lunch Time
- 13:40-14:40 Session 7 (Room B)
- Factory Design/Automated Material Handling (FD)
- 13:40-14:00 FD-196
- High Throughput AMHS Design with Dual Unified OHT System
ChungSoo Han/Spansion
- 14:00-14:20 FD-97
- Requirements for AMHS in 450 mm era
Hiroshi Kondo/Asyst Shinko
- 14:20-14:40
- Authors' Interview Hours/Coffee Break
- 11:00-12:20 Session 8 (Room C)
- Process Control and Monitoring (PC) Part 2 & Robust Engineering (RE)
- 11:20-11:40 PC-250
- A High Productivity and Low Topography WCMP Process with iScan and LAPC for 45nm
James C. Wang/Applied Materials
- 11:40-12:00 RE-62
- Application of quality engineering in semiconductor wafer process
Shigenobu Murashima/NEC Kansai, Ltd
- 12:00-12:20
- Authors' Interview Hours/Coffee Break
- 12:20-13:40
- Lunch Time
- 13:20-15:40 Session 9 (Room C)
- Final Manufacturing (FM)
- 13:40-14:20 Future Trend in Packaging Technology with View of the History
- Prof. Kanji Otsuka Meisei University
- 14:20-14:40 Design For Business: Advancing the Business Culture of Semiconductor Back-End Manufacturing
- Andres Carrasco/Nagase Electronic Equipment Service Co., Ltd.
- 14:40-15:00 FM-111
- Advanced dicing technology for semiconductor wafer -Stealth Dicing-
Masayoshi Kumagai/Hamamatsu Photonics K.K.
- 15:00-15:20 FM-224
- Root Cause Mechanism for Delamination/Cracking in Stacked Die Chip Scale Packages
Edward R. Prack/Intel
- 15:20-15:40
- Authors' Interview Hours/Coffee Break
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Mon, Sep 25 | Tue, Sep 26 | Wed, Sep 27 | Interactive
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- 8:00 Registration
- 9:00-9:10 ISSM 2007
- 9:10-10:50 Plenary Session Session
- Chair: Kensuke Uriga/Chairman, ISSM Program Committee/Dura Systems
- 9:10-10:00 Future Lithography Challenges
- Kazuo Ushida, President, Precision Equipment Company, Nikon Corporation
- 10:00-10:50 The Strategy for Manufacturing Technology Advancement in Memory
- Young-Bum Koh, Senior Vice President, Technology Center, Semiconductor Business, Samsung Electronics Co., Ltd.
- 10:50-11:10
- Coffee Break
- 11:10-12:30 Session 10 (Room A)
- Process and Materials Optimization (PO) Part 2
- 11:10-11:30 PO-109
- Thin-Gate CMOS and Super-Thick Gate DECMOS Integration in 0 Degree On-axis <100> Staring Wafer: Process Challenges and Solutions
Xiaoju Wu/Texas Instruments
- 11:30-11:50 PO-119
- Investigation on Metal Pillar Defect in sub-micron CMOS technology
Young Seon You/Systems on Silicon Manufacturing
- 11:50-12:10 PO-120
- A criterion for applying countermeasure to the electrostatic charging issue of wafer probers
Fumiyoshi Furuhashi/Spansion
- 12:10-12:30
- Authors' Interview Hours/Coffee Break
- 12:30-13:30
- Lunch Time
- 13:30-15:30 Session 11 (Room A)
- Process and Metrology Equipment (PE)
- 13:30-13:50 PE-82
- Method for fast and accurate calibration of litho simulator for hot spot analysis
Youval Nehmadi /Applied Materials
- 13:50-14:10 PE-183
- Recipe-independent Tool Health Indicator and Fault Prognosis
Argon Chen/National Taiwan University
- 14:10-14:30 PE-199
- Non-Destructive Monitoring of Silicon Consumption During Shallow Trench Isolation Formation on 45nm Node Devices Using Spectroscopic Ellipsometry
Robert M. Peters/KLA-Tencor
- 14:30-14:50
- Authors' Interview Hours/Coffee Break
- 11:10-12:30 Session 12 (Room B)
- Manufacturing Strategy and Structure (MS)
- 11:10-11:30 MS-174
- Using 'Locked Wafers' to Prioritize Factory Resources
John Pollock/Cypress Semiconductor
- 11:30-11:50 MS-251
- Evolutionary Engineering Collaboration for DFM/DFY Solutions between Foundry and EDA Tools Vendor: A Preliminary Exploration
Yea-Huey Su/National Central University
- 11:50-12:10 MS-147
- DFM Challenges for 32nm Node with Double Patterning Technology (DPT)
J. Fung Chen/ASML
- 12:10-12:30
- Authors' Interview Hours/Coffee Break
- 12:30-13:30
- Lunch Time
- 13:30-13:50 MS-252
- Business Model Innovation with Effective Execution: An Exploratory Study on TSMC
Yea-Huey Su/National Central University
- 13:50-14:10 MS-169
- APPROACH FOR A STANDARDISED METHODOLOGY FOR MULTI-SITE PROCESSING OF 300 MM WAFERS AT R&D-SITES
Richard Oechsner/Fraunhofer IISB
- 14:10-14:30 MS-173
- Managing dynamic events in full-load states of semiconductor manufacturing chains
Yon-Chun Chou/National Taiwan University
- 14:30-14:50 MS-91
- Monitor Cost Reduction through Application of Activity Based Costing
Chih-Wei Li/TSMC
- 14:50-15:10
- Authors' Interview Hours/Coffee Break
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Mon, Sep 25 | Tue, Sep 26 | Wed, Sep 27 | Interactive
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- 14:50-17:10 Session 13 (Room A)
- Summary Presentation for Interactive Poster Session Environment, Safety and Health (ES), Factory Design/Automated Material Handling (FD), Manufacturing Control and Execution (MC), Manufacturing Strategy and Structure (MS), Yeld Enhancement Methodology(YE)
- 14:50-15:00
- Introduction of Interactive 3-minutes Talk Session
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- 15:00-15:04 FD-189
- TFT-LCD Automated Guided Vehicle Systems Analysis
Young Jae Jang/MIT
- 15:04-15:08 FD-208
- Increased Fab Efficiency through the use of Small Lot Size FOUPs
Carl U. Buice, PhD/Asyst Technologies
- 15:08-15:12 ES-146
- Development of Slow Start Safety Cylinder Valve to Inhibit Adiabatic Compression for Oxidized Gases
Takashi Orita/Taiyo Nippon Sanso Corporation
- 15:12-15:16 ES-154
- Reduce VOC Emissions from Manufacturing Processes
TanLin Sheng/Intel
- 15:16-15:20 ES-254
- Development and Practical Application of High-efficiency Fire Control System for the Clean Room
Soji Fukuda/Hitachi Plant Technologies, Ltd.
- 15:20-15:24 MC-201
- Distributive and Cooperative Scheduling Considering Multi-Attribute Product-Mix,Feedback Processes,and the Dynamic Utility Control in Resource Sharing
Sumika Arima/University of Tsukuba
- 15:24-15:28 MC-163
- Framework for Event Driven Sorter Operation
Ryuji Tamehiro/IBM
- 15:28-15:32 MC-152
- Productivity improvement by integrated management of wafer map data
Norihiro.Takesako/Renesas Technology
- 15:32-15:36 MC-149
- Support Vector based Demand Forecasting for Semiconductor Manufacturing
Prasanna Kumar Chittari/Intel
- 15:36-15:40 MC-170
- Design of Segmented WIP Control for Cycle Time Reduction
Chen-Fu Chien/Department of Industrial Engineering and Engineering Management, National Tsing Hua University
- 15:40-15:44 MC-178
- Priority Behavior Modeling of Fab for Supply Chain Management
Shi-Chung Chang/National Taiwan University
- 15:44-15:48 MC-55
- Time Links Management Through Real-time Dispatch System
Chan Chih Ming/Chartered Semiconductor Manufacturing
- 15:48-15:52 MC-132
- Systemic Operation Tracking Production-progress and Control Delivery to Reach Customer Satisfaction
Jui Feng Hung/Powerchip Semiconductor
- 15:52-15:56 MC-76
- Integrated Production Control System in Managing Tool Uptime, Cycle-time and Capacity
Chan Chih Ming/Chartered Semiconductor Manufacturing
- 15:56-16:00 MC-233
- Manufacturing Challenges for Double Patterning Lithography
William Arnold/Mircea Dusa/ASML
- 16:00-16:04 MC-223
- Model Based Semiconductor Factory Automation for Rapid Factory Start Up and Change
Parris Hawkins/Applied Materials
- 16:04-16:08
- Break
- 16:08-16:16 MS-74
- Managing process constraint effectively to enable Fab cycle time reduction
HSU JUNG PIN/TSMC
- 16:16-16:20 MS-134
- Study of the relation between Loading ratio and x-Factor
Satoru Tsuruta/NEC Electronics
- 16:20-16:24 MS-241
- A Quadratic Goal Programming Model and Sensitivity Analysis for Semiconductor Supply Chain
David M. Chiang/National Taiwan University
- 16:24-16:28 MS-77
- Parts Cost of Ownership Mechanism for Constantly Reducing Variable Cost of Equipment at Semiconductor Fabs
Hsin Jung Yang/UMC
- 16:28-16:32 YE-240
- Nano-thickness stellar defects
Tsuyoshi Moriya/Tokyo Electron
- 16:32-16:36 YE-213
- Novel Application of Programmed Defects to Enhance 200/300mm SEM Navigation Accuracy During 65nm MirrorBit™ Development
Stacy Sakai/Spansion
- 16:36-16:40 YE-98
- Overall Wafer Effectiveness (OWE): A Novel Standard for Wafer Productivity
Chen-Fu Chien/TSMC
- 16:40-16:44 YE-207
- Novel Use of Discrete SEM Inspection to Supplement and Refine Inline Defect Inspection During 65nm MirrorBit™ Development
Go Nagatani/Spansion
- 16:44-16:48 YE-96
- Yield Methodology for Mixed Signal Process Development
Jin Liu/Texas Instruments
- 16:48-16:52 YE-73
- The Optimization of Chamber Cleaning in the Etching Equipment
Teruo Yajima/Spansion
- 16:52-16:56 YE-140
- A high resolution and early triggering method on multi layer processing defects
Chan Seong Choong/Systems on Silicon Manufacturing
- 16:56-17:00 YE-106
- Investigation of post STI liner oxide annealing effect in 0.14um embedded flash technology
Jin Li Juan/Systems on Silicon Manufacturing
- 14:50-17:10 Session 14 (Room B)
- Summary Presentation for Interactive Poster Session Process Control and Monitoring (PC), Process and Metrology Equipment (PE), Process and Materials Optimization (PO), Ultraclean Technology (UC)
- 14:50-15:00
- Introduction of Interactive 3-minutes Talk Session
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- 15:00-15:04 PC-1
- Integrated ODP metrology as an APC enabler for complex high aspect ratio 3D deep trench device structures
Barbara Schmidt /Qimonda
- 15:04-15:08 PC-50
- Threshold Voltage Asymmetry from Unintentional Angle of Implant on 90nm Floating Gate Flash Memory Devices
Arjun Rangarajan/Spansion
- 15:08-15:12 PC-141
- Real-time monitoring of plasma flickering in high pressure electronegative discharge
Yongjin Kim/Samsung
- 15:12-15:16 PC-175
- APC Methodology for Cpk improvement of HDP Deposition
Ramkumar Rajagopal/Intel
- 15:16-15:20 PC-162
- Low-K CMP Process Control by using Interpolation Method.
Shigeki Kato/NEC Fabserve
- 15:20-15:24 PC-229
- Utilization of insitu metrology capability of ASML Lithography Scanner to improve overall process control
Alek Chen/ASML
- 15:24-15:28 PC-203
- Challenges of Manufacturing Capacitor Oxide in Mixed Signal ASICS
Janet Towner/AMI Semiconductor
- 15:28-15:32 PC-228
- Real-time Monitoring of Photoresist Thickness Contour in Microlithography
Ho Weng Khuen/National University of Singapore
- 15:32-15:36 PC-137
- Using product test data for manufacturing process control
Gerhard Spitzlsperger/Renesas Semiconductor Europe
- 15:36-15:40 PC-236
- Samsung Equivalence Test for Output Parameters in Semiconductor Manufacturing
Ho Young Lee/Samsung
- 15:40-15:44 PC-232
- ISMI Victory: Interface A Ready for Manufacturing
Harvey Wohlwend/International SEMATECH Manufacturing Initiative (ISMI)
- 15:44-16:05
- Break
- 16:05-16:09 PE-145
- Yield enhancement/Productivity improvement for Sub-110nm Memory Lithography using new alignment strategy
CI_Choi/SMIC
- 16:09-16:13 PE-86
- A Technique for Discharge Stabilization Using an Ion Gauge
Tatsuo Muraoka/Fujitsu
- 16:13-16:17 PE-188
- The ROI of Metrology
Benjamin Bunday/International Sematech
- 16:17-16:21 PO-253
- Advantage of Siconi TM Preclean over Wet Clean for Pre Silicide Applications Beyond 65nm Node
Jianxin Lei /Applied Materials
- 16:21-16:25 PO-89
- Improved CVD-Al Thin Film Using Superior Al Precursor
Seung-Min Ryu/Samsung
- 16:25-16:29 PO-160
- Endpoint detection of dry cleaning on LPCVD Poly-Si process
Shinobu Asada/NEC Fabserve
- 16:29-16:33 PO-167
- Use of Vertical Scanning Interferometry to Optimize HDP Oxide Thickness for STI CMP
Peter J. Beckage/Spansion
- 16:33-16:37 PO-78
- Reliable High Volt Mixed Signal IC Manufacturing
John J. Naughton/AMI Semiconductor
- 16:37-16:41 PO-205
- Development of SiN ESL for Cu BEOL of Advanced Flash Memory Devices
Minh-Van Ngo/Spansion
- 16:41-16:45 UC-157
- A new air cleaning and cooling instrument usig oblique honeycomb
Satoshi Minobe/Nichias Corporation
- 16:45-16:49 UC-156
- New QCM Sensor for Real-time AMC Detection in SMIF Pods
Ryozo Takasu/Fujitsu Laboratories Ltd.
- 16:49-16:53 UC-218
- The Static Elimination System with Soft X-ray Air Ionizer Used in ULSI Cleanroom
Masafumi Sakuyama/Ibaraki University
- 16:53-16:57 UC-103
- Inline VPD-TXRF for Contamination Control: Reality or Myth? Experience in a 300mm R&D Flash Memory Fab
Ercan Adem/Spansion
- 16:57-17:01 UC-161
- The wafer preparation technology with nano size particle contamination by using single spin processor
Kousaku Matsuno/mFSI
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