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Monday, September 25 - Wednesday, September 27, 2006
Century Hyatt Tokyo, Japan
ABSTRACT DEADLINE: MONDAY, MAY 15, 2006
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Sponsored by: The Japan Society of Applied Physics
IEEE Electron Devices Society and
Semiconductor Equipment and Materials International (SEMI)
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ISSM is the industry's largest forum of semiconductor manufacturing professionals dedicated to sharing technical solutions and opinions on the advancement of manufacturing science. The highlight topics of ISSM 2006 include, process control maturation, application of Taguchi Method, DFM-total optimization for 65nm and beyond, systematic productivity improvement, fab extendibility and flexibility, application-specific semiconductor manufacturing, SiP, 3D modules, Environmental and safety, nanometer-level contamination control, challenges for 450mm fab, and new business model to meet with time-to-market.
ISSM 2006 provides an exciting opportunity for all semiconductor professionals to network and share information on the world of manufacturing. The Society of Applied Physics of Japan, IEEE Electron Devices Society, and Semiconductor Equipment and Materials International (SEMI) offer ISSM as a forum to broaden semiconductor manufacturing knowledge. We look forward to seeing you in September
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ISSM 2006 Schedule and Areas of Interest
- Factory Design (FD)
- Manufacturing Control and Execution (MC)
- Manufacturing Strategy and Structure (MS)
- Process Control and Monitoring (PC)
- Process and Metrology Equipment (PE)
- Yield Enhancement Methodology (YE)
- Ultraclean Technology (UC)
- Environment, Safety and Health (ES)
- Process and Material Optimization (PO)
- Final Manufacturing (FM)
- Robust Engineering (RE)
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| Monday, Sept. 25 |
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Andrzej J. Strojwas
Professor of Electrical and Computer Engineering Carnegie Mellon Univ.
Chief Technologist PDF Solutions, Inc.
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Song Hwee Chia
President and Chief Executive Officer
Chartered Semiconductor Manufacturing
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| Tuesday, Sept. 26 |
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Yoshifumi Kawamoto
Director
General Manager
R&D Department
Consortium for Advanced Semiconductor Materials and Related Technologies (CASMAT)
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Shozo Saito
Executive Vice President
Toshiba Semiconductor Company
Corporate Vice President
Toshiba Corporation
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| Wednesday, Sept. 27 |
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Kazuo Ushida
President
Precision Equipment Company
Nikon Corporation
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Young-Bum Koh
Senior Vice President, Technology Center, Semiconductor Business,
Samsung Electronics Co., Ltd.
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Registration Fee: Three-day 50,000 Yen (after Aug. 28, 60,000 Yen)
Single Day (Sept. 26 or 27) 30,000 Yen (after Aug. 28, 36,000 Yen)
Student Registration available at 10,000 Yen
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For further information and registration, please visit ISSM website at www.issm.jp
ISSM 2006 Secretariat at Semiconductor Portal, Inc. issm_2006@semiconportal.com Phone: +81-3-3560-3565
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