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The evaluation result was notified to all authors who submit abstract to ISSM 2006 on June 26, 2006. In case that the author has not received any message, please contact with us at issm_2006@semiconportal.com
 CALL FOR PAPERS
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Thank you for your visit to ISSM 2006 website.
 ISSM 2006 CFP(WORD)
ISSM 2006 CFP JAPANESE VERSION(WORD)
 ISSM 2006 Abstract Template
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HIGHLIGHTS
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ISSM 2006 will specially feature the highlights of the advanced semiconductor manufacturing including:
Toward Process Control Maturation
Implementation from development to HVM
Tool level and Fab level integration (EES)
Incorporation of multiple process steps (PQC)
Application of Taguchi Method
Building robustness and quality into design and products at developmental stage
MTS/TS applications to predict and diagnose yield, quality and device characteristics
Optimizing balance between quality and cost
DFM - Total Optimization for 65nm and beyond
Collaboration between design and manufacturing
Inspection and metrology technique for design
Resolution Enhancement Technology (RET)
OPC, systematic defects, process window, APC
Productivity Improvement
Bottleneck equipment productivity
Improvement in both throughput and cycle time
-On-time-delivery, raw process time reduction
Queue time control
Benchmarking on productivity
Fab Extendibility/Flexibility
Reuse of buildings, production equipments and information systems across multiple technology nodes
Application Specific Semiconductor Manufacturing
Mixed Signal/Radio Frequency/Power/Automotive
Measure against Noise, High Reliability
High Voltage Tolerance, Certification, MEMS, Sensor
SiP, 3D Modules
SiP (System in Package)
Thin Wafer less than 75 um
Lead free bump, 3D packaging
Environmental and Safety Activities
Activities for WSC 2010 targets in ESH focus areas
(energy-saving, greenhouse-gases emission reduction)
Activities and precautions against earthquake and fire
Post-disaster recovery from earthquake and fire
Nanometer-Level Contamination Control
Mini-Environment/FOUP
Damage-free wet cleaning
Challenges for 450mm Fab
Overall issue for design and manufacturing
Introduction Schedule, ROI, Wafer, Equipment
Control System, Single wafer transportation
Standardization
New Business Model
Response to rapidly changing, complex business requirements
Reduced time to ramp factories and products
Global Supply Chain Management
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IMPORTANT DATES
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Abstract submission start
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Monday, April 10, 2006
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Abstract submission due
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Monday, May 15, 2006
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Notification of paper acceptance
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Monday, June 26, 2006
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Selected final papers due
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Friday, August 18, 2006
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Final Presentations due
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Monday, September 18, 2006
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Abstracts will be selected from the following areas of interest (details):
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Call for Paper
Areas of Interests
